What's New? |
The 1999-2000 Beckman Scholars: Hau My Ho
Beckman research project in the White group: High dielectric constant materials for microelectronics: The goals of this Beckman Scholar project relate to a problem of fundamental and technological interest, namely, the formation and properties of interfaces between dielectric materials and silicon. Dielectrics and silicon form the basis for much of modern electronics technology. As device structures shrink in size into the sub-0.25 micron regime, in order to enhance device speed and compactness, the interfaces between the dielectric and the semiconductor become more important. The argument can be made that there is no longer any bulk dielectric because it is so thin (< 0. 3 nm). The chemical properties of these interfaces are of central importance and lie at the heart of the proposed project. Zirconium Dioxide is found to be a good candidate for a high dielectric material useful in these situations, with a dielectric constant of 22, showing good adhesion to Si(100) substrate surfaces, and it has a wide bandgap (5.16eV), i.e., it has high barrier heights to electrons and holes from silicon. In addition, ZrO2 is thermodynamically stable in the presence of silicon. However, it has been observed that ZrO2 films deposited on Si(100) using PVD (physical vapor deposition) contain interface silicon dioxide layers which reduce the usefulness of the material as a barrier due to the low k value of SiO2 (4.1 eV). Thus the questions to be resolved were: Will the deposition of Zr reduce the silicon dioxide layer when it is dosed onto a thin layer of SiO2, and what interfacial reactions occur between Zr and Si(100) covered with native oxide. To answer these questions, Zr films were prepared on bare and native oxide-covered silicon substrates using PVD at low pressure (on the order of 10-7 to 10-8 torr). Chemical analysis was carried out subsequently using X-ray photoelectron spectroscopy (XPS) and X-ray Diffraction (XRD). The films were found to be amorphous (XRD) and the silicon oxide layer is reduced at 300 K during deposition of Zr (XPS). Non-stoichiometric zirconium silicate was found to form at the interface according to the reaction: Zr + SiO2 < > ZrSiYOX (x < 2, y < 2). |
||||
Created and maintained by Ruth Shear. Comments to author at DrRuth@mail.utexas.edu Created Mon Mar 22nd 1999. Last modified Mon, Mar 10, 2014. |